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Plating Thickness Tester (Thick 800) |
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 Model Number |
Thick 800 |
| Descriptions, sepcifications and configurations |
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Features:
Thick800 is specially designed for rapid and non-destructive detection of plating thickness and elemental analysis. Thick800 adopts best lightening structure, 3-D movable sample platform and laser positioning system, which enable the point-by-point detection of plating thickness and elemental content on large-size sample.The up-and-down movable glass shield helps to prevent the radiation of X-Rays away from operator.
Technical Specifications:Analysis Range: Element K~U.
Multiple layers are able to be analyzed simultaneously.
The accurate of thickness measurement is 10nm.
More than 5 layers can be analyzed simultaneously.
Independent matrix effect correction models.
Most advanced thickness analysis recipes.
Repeatability is up to 10nm.
Long-period Working Stability and feasibility is lower than 10nm.
Configurations:
Open sample chamber
3-D movement is realized by 2-D movable platform and up-and-down movement of detector and x-ray tube.
Double-laser positioning system.
Automatic collimator switch
Glass shield cap
Electronic circuit for signal detection
High and low voltage power supply
Electro-cooling Si-Pin semiconductor detector instead of liquid nitrogen cooling ones
X-ray tube
PC and ink-jet printer
Sample chamber: 20X14X5In (517mmx352mmx150mm)
Machine Dimension: 26X19X21In (648mmx490mmx544mm)
Safety
(1) The shield cover of the instrument has interlocks with high voltage of X-tube. When the cover is open, the X-ray tube is shut down to prevent X rays from leaking outside.
(2) The up-and-down movable glass shield can help to prevent the radiation of X-Rays away from operator.
(3) The X-ray tube has interlocks with software, the tube is shut down when the software is not running.
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